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Electroless & Electroplating

For prototyping and single lot printed circuit boards, the through holes in a copper clad board must be properly prepped before they can be electroplated by a standard copper plating process. Through-hole preparation requires making the through hole walls conductive, as it requires a conductive surface to allow electroplating. The electroless plating process makes this possible by applying a thin layer of copper to the inside of each through hole. While this is not sufficient to carry normal circuit loads, it is sufficient enough to allow electroplating to.

Copper Electroplating Solution

Copper Electroplating Solution

41670-1L

Price:  $ 11.43

3 In Stock


Tin Electroplating Solution

Tin Electroplating Solution

41672-1L

Price:  $ 11.43

Available for back order.