Temperature Controlled Reflow Oven

The HHL3000 Reflow Oven is a highly versatile tool used for reflowing and preheating different surface Mount technology (SMT) components and printed circuit boards (PCB's). The system utilizes a microcontroller to effectively and efficently manage the working temperature while facilitating the duration of the heating process. A bright LED display clearly displays the time and temperature along with a fully digital control panel for ease of use and monitoring.

The HHL3000 makes use of infrared (IR) heat wave technology to distribute heat evenly on the component and PCB. Included is an integrated temperature sensor that allows positioning in such a way that the measurement of the actual temperature of PCB and components can be obtained. This minimizes damage to the PCB and its components due to thermal shock or low level temperature conditions.

FUNCTIONS and FEATURES  

• Microprocessor-controlled equipment.
• Direct PCB temperature measurement, improves accuracy and lessens damage or distortion.
• Five (5) temperature and time control points with automatic slope adjustment. Configurable to suit different solder paste and circuit boards.
• Two (2) default profiles suitable with most common solder paste specifications.
• Quick and easy resetting of control points for precise tuning of reflow profiles.
• Built-in safety feature of industry standard 0.01°C/s to 3°C/s rising slope.
• Fully digital panel controls and read-out of time and temperature for monitoring and ease of use.
• Highly compatible with lead-free applications.

Users Manual